Etching Techniques: The Basics for Precision Manufacturing

Micronit offers a comprehensive range of etching techniques that can be utilized to meet any requirements in precision manufacturing. With over 25 years of experience, we specialize in guiding our customers through every step of the way, from idea to manufacturing. 

Etching and Lasering Techniques 

Etching is a technique used to remove material from a glass or silicon substrates surface by means of chemical or physical interactions. By making use of lithography technology, parts of the surface can be shielded from the etching, creating specific patterned 3-dimensional surface geometries. And fluidic channels and chambers with pillars can be realized with nanometer accuracy. Micronit has vast experience in etching using glass and silicon, and we also offer possibilities to etch thin films consisting of dielectrics and metals.  

Etching can be performed using wet or dry techniques, depending on the substrate material and the desired geometry of the etched structure. In wet etching, liquid chemicals are used, whereas dry etching makes use of gases or plasmas as etchants. Herein, wet etching is based on chemical removal of substrate surface material, whereas dry etching combines both chemical and physical removal.  

Alternatively, Micronit has in-house laser etching technologies allowing for the realization of vias in glass substrates, which is the primary technique for fast and accurate drilling of complete wafer-through holes for microfluidic in- and outlets.  

Wet Etching: Uniform and Reproducible 

Our wet (chemical) etching methods are ideal for creating structures in glass and silicon. At Micronit, we master both isotropic (glass) and anisotropic (silicon) etching methods, each with their unique advantages for specific applications. With dedicated spray etch technology we can provide highly uniform and reproducible etch results over a single substrate surface, over many substrates and over many production runs. For more information, got to our wet etching page.  

Dry Etching: For More Complex Issues 

For projects requiring more control of the shape of the etched geometry (including side walls), the solution is using a dry etching method. With this method, the substrate is loaded into a sealed process chamber, in which plasma is created under vacuum from special process gases. 

From this plasma, reactive species are created allowing for chemical or physical interactions with the substrate. The complex combination of variables in the process chamber allows for steering to process to maximum precision. Which allows us to successfully realize the most challenging projects. For more detailed information, go to our dry etching page. 

Dry & Wet Etching Techniques Overview 

Getting started 

At Micronit, we take pride in our role as your development and manufacturing partner. We understand that developing a high-quality product cannot be done without the knowledge of specialized manufacturing techniques. That is why we can put our extensive expertise to work to bring your ideas to life. From concept to production, we are here to guide you with solutions that exceed your expectations. Want to learn more about our technical capabilities? Download our complete overview of capabilities.

Do you have a project that would benefit from our etching solutions? Our experts are ready to work with you and turn your ideas into reality! Contact us and find out how Micronit can support your projects with our advanced etching techniques.