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Surface properties refresh
Glass microfluidic chips are durable and can be often used for a long period when well cared for. We have seen examples of chips that are used for many years after each other.
Because the glass is very clean after production it has strong hydrophilic properties. This hydrophilic effect is caused by molecules that are in a reactive state. However, those molecules can also react with molecules in the surroundings, making the surface less hydrophilic. This can be, for instance, additives used in manufacturing plastic packaging materials. This is not something that will happen directly but will happen when products are stored for a longer period (multiple years).
No worries, this can be easily resolved by following the protocol as found below.
When needed?
This protocol is only intended for uncoated chips, with hydrophilic properties. It’s useful to apply in all cases where unusual surface interaction is observed. An example of unusual surface interactions can be oil that locally attaches to the glass. Also prolonged use of the chip can influence the surface properties which cleaning is not always able to fully fix.
It’s important to note that this protocol is an addition to cleaning and not a replacement, it’s recommended to well clean the chips before applying this protocol as some substances might not fully disintegrate.
What equipment do you need?
· Hot plate or oven that can go up to 500˚C / 932˚F
· Timer (when not available on the oven or hotplate)
Preparations
- Topconnect chips are supplied in a Microfluidic Slide (this is the black cartridge around the chip. When present this cartridge needs to be removed as it cannot withstand this temperature. To remove the fluidic slide:
- Turn the chip with fluidic slide facing in this direction (back-side):
- Press gently with increasing force on the glass with a finger while supporting the fluidic slide at the corner position:
At some point the glass element will get loose
- Turn the chip with fluidic slide facing in this direction (back-side):
- Make sure the hot plate surface or oven is clean before use. Perform a cleaning cycle where necessary
Procedure oven
- Place the chips with the inlet holes facing downwards for topconnect chips on a suitable oven cold oven tray, so the inlet holes are open, and air can expand.
Don’t place anything on top of the chips, so the air can still expand. For sideconnect chips the orientation is not critical. - Place the oven tray in a cold oven
- Turn the oven on and wait until it reaches its 500˚C / 932˚F setpoint.
- Let the chips bake for 30 minutes at this set-point
- Turn the oven off and let it completely cool down.
Procedure hot plate
- Place the chips with the inlet holes facing downwards for topconnect chips on top of the cold hotplate surface, so the inlet holes are open and air can expand.
For sideconnect chips the orientation is not critical. - Turn the hotplate on and wait until it reaches its 500˚C / 932˚F setpoint.
- Let the chips bake for 30 minutes at this set-point
- Turn the hotplate off and let it completely cool down.
Re-insert in Fluidic slide
When necessary, the chips can be re-inserted in the fluidic slide. This can be done by sliding the chips into the cartridge from left to right.
