The need for good packaging of MEMS and MST products is expanding. The package is one of the most important elements of a micro device, as it protects the functional unit (sensor, integrated circuit or micromechanical components) against harming influences.
Wafer Level Packaging
Micronit supplies a wide range of possibilities in custom wafer scale packaging. With our microfluidics foundry services we are able to make structured glass and silicon wafers up to 12 inch, with through holes, cavities, structures or trenches and electrical contact pads. Hole density is of no importance. The wafers can be made of different glass types.
Using glass wafers for wafer scale packaging has very advantageous characteristics, as they are:
- optically 100% clear;
- made from non conducting material;
- relatively easy to manufacture and to scale up;
- same temperature coefficient as silicon, which makes bonding possible without glue or adhesives;
- more economical than structured silicon wafers.
Compared to ultrasonic drilling, powderblasted structured wafers have much better tolerances in hole-to-hole distance. There is no limitation on the number of holes or cavities. Since all holes are made in one go the price is independant of the number of holes.
Micronit has standard wafers in its product portfolio, but a customized design can be manufactured, too. In the table below the capabilities of our wafer production is given.
> 50 µm
|> 5 µm
0.1 - 100 µm
approx. 0.1 µm
4" - 6" (round / square)
|Integration of metal layers
Shapes / Structures
|Pt (standard), Au, Cu or other
borosilicate, fused silica, silicon
any designed structure
1,100 µm, 700 µm, 400 µm, 175 µm or 100 µm